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Apple reportedly tests CXMT chips, showing China-US industrial chain cooperation ‘irreversible’: experts_我的网站
一 | 8月26日消息，苹果推出新款Mac mini与Mac Studio，最高分别搭载2nm芯片M6及M5 Ultra芯片，在性能和AI能力上实现了颠覆性跃升。 
View of iPhones at a store in Shanghai on August 5, 2026 Photo: VCG
After media reports saying that US tech firm Apple has been testing memory chips from Chinese chipmaker ChangXin Memory Technologies (CXMT) across product lines including iPhones and MacBooks, Chinese experts said on Monday that Apple may seek to adopt memory chips from CXMT to control rising costs for its electronic devices despite obstruction by some US politicians.
If the report is true, the move would not only underscore the technological leap and rising global competitiveness of China's semiconductor sector, but also demonstrate that deeper supply‑chain integration among multinationals is an irreversible trend, experts noted.
Apple has held early talks with CXMT about supplying components with the goal of using them in some devices sold in China, The Wall Street Journal reported on Sunday, citing people familiar with the matter. "Apple hopes to win the White House's blessing to do business with the Chinese company," the report stated.
Laptop makers HP and Acer have begun using memory chips from CXMT in devices sold outside the US to alleviate ongoing memory supply strain, people familiar with the matter said, according to the report.
Both companies didn't reply when reached by the Global Times on Monday for comment.
"Amid a sizable global memory supply crunch, Apple is forced to widen its supplier base to contain rising costs. Thus, despite heavy US political pressure, it is highly likely to adopt CXMT chips," Ma Jihua, a veteran technology industry analyst, told the Global Times on Monday.
In June, Apple raised iPad and MacBook prices, saying it could no longer shield customers from soaring memory and storage chip costs driven by the AI industry's datacenter buildout, Reuters reported.
Against this backdrop, CXMT has emerged as a potential counterweight to these cost pressures. The company's shares closed up 465.82 percent on its July 27 market debut, giving it a market capitalization of over 3.2 trillion yuan ($471.2 billion), becoming one of the world's largest producers of dynamic random-access memory (DRAM) and the most valuable listed company on the A-share market.
"Represented by CXMT, a batch of Chinese hard-tech firms constantly focus on innovations in recent years. Their product performance and supply capacity are steadily approaching international advanced levels, attracting an increasing number of market-driven multinationals to actively embed themselves in China's supply chains," Bao Jianyun, dean and professor of the Department of International Politics at the School of International Studies at Renmin University of China, told the Global Times on Monday.
China's exports of integrated circuits (ICs) reached $216.02 billion in the first seven months of 2026, up 99.5 percent year-on-year, according to data released by the General Administration of Customs (GAC) on Friday.
Prompted by the rapid development of integrated circuit technologies and the need to better meet market demands, China recently issued revised regulations on the protection of IC layout-designs. Scheduled to take effect on October 15 this year, the regulation aims to strengthen the protection and application of layout-designs and improve registration and management systems by elevating proven practices into regulations, while also aligning with relevant laws and international treaties.
These institutional upgrades, paired with policies to boost domestic demand and improve market access, are reinforcing China's appeal as a stable anchor for global semiconductor investment.
Samsung Electronics and SK Hynix are evaluating chipmaking equipment from China's Advanced Micro-Fabrication Equipment for possible use at their Chinese factories, three people familiar with the matter said, as the South Korean firms hedge against the risk of tighter US export controls, Reuters reported on August 5.
"If these reports are true, the trend once again shows that it's an irreversible historical tide for multinationals to expand cooperation with Chinese firms according to market principles. The US side's political attempt to build 'small yard, high fence' and push 'decoupling' is doomed," Bao said.
The rise of Chinese-made memory chips and recent tech innovations - including Unitree Robotics' humanoid robots and Moonshot's Kimi K3 - underscore that unilateral US sanctions cannot prevent Chinese technological iteration, nor can protectionism block open cooperation, the expert said.
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M6是苹果首款采用2nm制程的芯片，所有计算模块均获得全面升级。其配备12核中央处理器，包含2颗超级核心、4颗性能核心和6颗能效核心，三种核心均具备业界领先的性能功耗比。 单线程性能全面领跑，多线程性能较M5提升最高达1.2倍，较M1提升最高达2.4倍。
AI算力方面，M6搭载双16核神经网络引擎，峰值计算性能较前代提升最多达2倍。统一内存最大可达32GB，带宽高达170GB/s，较M5提升10%，较M1提升2.5倍。 GPU升级为12核（每颗核心内置神经网络加速器），AI峰值计算性能较M5提升近30%，较M1提升超过8倍。 此外，M6还集成了苹果最新的图形能力，包括更新的着色器核心架构、动态缓存和硬件加速光线追踪技术。相比M5，M6多出2颗中央处理器核心和2颗图形处理器核心，加之神经网络引擎与内存带宽的改进，能更高效地应对各类工作负载。
二 | M5 Ultra是苹果迄今为止最强大的芯片，专为专业人士打造。苹果首次在M系列自研芯片中采用UltraFusion封装技术，将两枚双晶粒M5 Max芯片互联，形成四晶粒架构。该技术将晶粒间带宽提升至4.4TB/s以上，连接密度提升逾6倍。
三 | M5 Ultra搭载最多36核的大尺寸中央处理器（含12颗超级核心和24颗性能核心），单线程性能较M3 Ultra提升最高达1.25倍，多线程性能提升最高达1.3倍。
GPU多达80核，同样内置神经网络加速器，支持最新着色器核心、第二代动态缓存、硬件加速网格着色及第三代光线追踪技术，图形性能较M3 Ultra提升最高达40%。 媒体处理引擎进一步强化，专属硬件加速H.264、HEVC、四个ProRes编解码引擎及硬件加速AV1解码一应俱全。32核神经网络引擎可在设备端以业界领先能效安全驱动复杂AI任务。 内存配置同样惊人，最高支持512GB统一内存，带宽高达1.2TB/s，较M3 Ultra提升50%，为专业创作和超大型工作负载提供充沛保障。
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